JPH0521807Y2 - - Google Patents
Info
- Publication number
- JPH0521807Y2 JPH0521807Y2 JP8082888U JP8082888U JPH0521807Y2 JP H0521807 Y2 JPH0521807 Y2 JP H0521807Y2 JP 8082888 U JP8082888 U JP 8082888U JP 8082888 U JP8082888 U JP 8082888U JP H0521807 Y2 JPH0521807 Y2 JP H0521807Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- diaphragm
- substrate
- pressure
- receiving surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 45
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000010408 film Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
Landscapes
- Contacts (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8082888U JPH0521807Y2 (en]) | 1988-06-17 | 1988-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8082888U JPH0521807Y2 (en]) | 1988-06-17 | 1988-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH023629U JPH023629U (en]) | 1990-01-11 |
| JPH0521807Y2 true JPH0521807Y2 (en]) | 1993-06-04 |
Family
ID=31305643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8082888U Expired - Lifetime JPH0521807Y2 (en]) | 1988-06-17 | 1988-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521807Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2576426B2 (ja) * | 1994-10-28 | 1997-01-29 | 日本電気株式会社 | 半導体装置のボンディング方法及びボンディング装置 |
| JP4697853B2 (ja) * | 2005-01-13 | 2011-06-08 | エヌイーシー ショット コンポーネンツ株式会社 | 圧力スイッチおよびその製造方法 |
-
1988
- 1988-06-17 JP JP8082888U patent/JPH0521807Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023629U (en]) | 1990-01-11 |
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